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AMD will invest more than $10 billion across Taiwan’s semiconductor ecosystem to strengthen AI chip manufacturing and packaging technologies. The move supports deployment of the company’s next-generation Helios AI server platform in 2026.
AMD CEO Lisa Su dismissed fears of an AI spending bubble, saying Big Tech’s aggressive investments in computing infrastructure are essential to accelerating innovation and long-term growth.
OpenAI has entered into a strategic agreement with AMD to supply high-performance AI chips, diversify its hardware sources, and build next-gen compute capacity.