Samsung Electronics plans to start production of next-generation high-bandwidth memory chips, HBM4, next month and supply them to Nvidia, a source familiar with the matter told Reuters. The move is part of Samsung’s effort to close the gap with rival SK Hynix, a key supplier of advanced memory chips for AI accelerators, after supply delays affected earnings and share prices last year. Samsung shares rose 2.2 percent, while SK Hynix fell 2.9 percent in early trading.
South Korean media reported that Samsung passed HBM4 qualification tests for Nvidia and AMD and is expected to start shipping to Nvidia next month. SK Hynix plans to begin deploying silicon wafers next month at its M15X fab in Cheongju but has not confirmed whether HBM4 will be part of initial production. Both companies are set to release fourth-quarter earnings on Thursday, where HBM4 order details may be disclosed.
Nvidia CEO Jensen Huang said its next-generation Vera Rubin chips are in “full production” and will be paired with HBM4 memory. The launch follows broader AI chip developments, including Microsoft’s recent unveiling of the Maia 200 AI chip, built with TSMC to power GPT-5.2 and Microsoft 365 Copilot, highlighting continued global competition in AI hardware.
